Candidate should open to work in us & uk & Indian Timings Punctuality for all work-related events. Always looking for ways to improve your skills Coming to work on time A positive attitude toward your job in general. Flexibility when assigned work tasks. Interested candiate please send you cv to Regards Nirmal shah 8097047048 1.00-6.00 Years 12th Class (XII) The original job offer can be found in Kit Job: www.kitjob.in/job/20885610/web-designer-graphic-designer-work-from-home-i-716-nct/

Candidate should open to work in us & uk & Indian Timings Punctuality for all work-related events. Always looking for ways to improve your skills Coming to work on time A positive attitude toward your job in general. Flexibility when assigned work tasks. Interested candiate please send you cv to Regards Nirmal shah 8097047048 1.00-6.00 Years 12th Class (XII) The original job offer can be found in Kit Job: www.kitjob.in/job/20885631/t719-web-designer-graphic-designer-work-from-home-mumbai/

Candidate should open to work in us & uk & Indian Timings Punctuality for all work-related events. Always looking for ways to improve your skills Coming to work on time A positive attitude toward your job in general. Flexibility when assigned work tasks. Interested candiate please send you cv to Regards Nirmal shah 8097047048 1.00-6.00 Years 12th Class (XII) The original job offer can be found in Kit Job: www.kitjob.in/job/20885691/yt795-web-designer-graphic-designer-work-from-home-ahmadabad/

Candidate should open to work in us & uk & Indian Timings Punctuality for all work-related events. Always looking for ways to improve your skills Coming to work on time A positive attitude toward your job in general. Flexibility when assigned work tasks. Interested candiate please send you cv to Regards Nirmal shah 8097047048 1.00-6.00 Years 12th Class (XII) The original job offer can be found in Kit Job: www.kitjob.in/job/20885639/lbe-217-web-designer-graphic-designer-work-from-home-bangalore-rural/

About the company: We are looking for a creative graphic designer who can create stunning visual images for social media marketing purposes.About the internship: Selected intern's day-to-day responsibilities include: 1. Interfacing with managers to understand design objectives and requirements 2. Creating design briefs in line with the expectations 3. Brainstorming to generate out-of-the-box and innovative concepts and ideas 4. Designing and creating print and web-related marketing collateral like posters, flyers, etc.Number of internships available: 1

Req. ID: # Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As a package designer at Micron Technology, Inc you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner – and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out. Qualifications: -Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience -Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must -Minimum 2+ years’ experience in packa

Req. ID: # Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As a package designer at Micron Technology, Inc you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner – and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out. Qualifications: -Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience -Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must -Minimum 2+ years’ experience in packa

Req. ID: # Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As a package designer at Micron Technology, Inc you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner – and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out. Qualifications: -Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience -Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must -Minimum 2+ years’ experience in packa

Job Description Recruiter NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile consumer and high performance applications Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people We are looking for a hardworking Semiconductor Packaging Master Designer to join…

Job Description Recruiter NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile consumer and high performance applications Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people We are looking for a hardworking Semiconductor Packaging Master Designer to join.

Req. ID: # Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As the package design manager at Micron Technology, Inc you will be responsible for the enablement of effective package layouts that meet exceptional technical standards. In this highly visible role, you will own and drive advanced package design and development. You will have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out. In addition to hands-on design, you will also be responsible to growth and management of several technical direct. You will be also required to scale your group to meet business requirements. You will have end-to-end design ownership on a wide variety o

Req. ID: # Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications? Are you looking to lead and strengthen a team of experts who will get to work on products that impact billions of people? We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As a package designer at Micron Technology, Inc you will be responsible for the layout and design of effective package layouts that meet outstanding technical standards. You will own and drive advanced package design and layout in a timely manner – and have ultimate responsibility for package/SIP layout, optimization, layout verification and taping out. Qualifications: -Bachelors or advanced degree in Electrical or Mechanical or Electronics Engineering with significant technical experience -Minimum 3+ years hands on experience with Cadence APD/SIP or equivalent mentor tools is a must -Minimum 2+ years’ experience in packa

We have a known technical issue and may not be able to upload your resume at this time. Search by Keyword Search by Location alert frequency in every certain days Share this Job ASIC Package Design Engineer(SeniorPrincipal) Hyderabad, AP, IN Req. ID: 152084 Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications Are you looking to collaborate with a team of industry authorities to build products that impact billions of people We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As an ASIC package designer at Micron Technology, Inc you will be responsible for the enablement of complex flip-chip package layouts that meet exceptional technical standards, including electrical, mechanical and thermal performance. In this highly visible role, you will own and drive advanced package design and development for advanced flip-chip packages. You will have ultimate respon

We have a known technical issue and may not be able to upload your resume at this time. Search by Keyword Search by Location alert frequency in every certain days Share this Job ASIC Package Design Engineer(SeniorPrincipal) Hyderabad, AP, IN Req. ID: 152084 Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications Are you looking to collaborate with a team of industry authorities to build products that impact billions of people We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As an ASIC package designer at Micron Technology, Inc you will be responsible for the enablement of complex flip-chip package layouts that meet exceptional technical standards, including electrical, mechanical and thermal performance. In this highly visible role, you will own and drive advanced package design and development for advanced flip-chip packages. You will have ultimate respon

We have a known technical issue and may not be able to upload your resume at this time. Search by Keyword Search by Location alert frequency in every certain days Share this Job ASIC Package Design Engineer(SeniorPrincipal) Hyderabad, AP, IN Req. ID: 152084 Recruiter: NIRMAL BEHERA Do you like to work on groundbreaking technologies that span mobile, consumer and high-performance applications Are you looking to collaborate with a team of industry authorities to build products that impact billions of people We are looking for a hardworking Semiconductor Packaging Master Designer to join our global team. As an ASIC package designer at Micron Technology, Inc you will be responsible for the enablement of complex flip-chip package layouts that meet exceptional technical standards, including electrical, mechanical and thermal performance. In this highly visible role, you will own and drive advanced package design and development for advanced flip-chip packages. You will have ultimate respon

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